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DataPort","2025-05-19T15:50:25.567Z","2025-05-19T15:51:19.719Z","2025-05-19T15:50:27.934Z","203",{"id":284,"name":1263,"alternativeText":16,"caption":16,"width":1264,"height":987,"formats":1265,"hash":1287,"ext":19,"mime":20,"size":1179,"url":1288,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1289,"updatedAt":1289},"LargeDataPortLogo.png",1002,{"large":1266,"small":1271,"medium":1277,"thumbnail":1282},{"ext":19,"url":1267,"hash":1268,"mime":20,"name":1269,"path":16,"size":1270,"width":825,"height":987},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Large_Data_Port_Logo_e13a318ba1.png","large_Large_Data_Port_Logo_e13a318ba1","large_LargeDataPortLogo.png",33.51,{"ext":19,"url":1272,"hash":1273,"mime":20,"name":1274,"path":16,"size":1275,"width":66,"height":1276},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Large_Data_Port_Logo_e13a318ba1.png","small_Large_Data_Port_Logo_e13a318ba1","small_LargeDataPortLogo.png",16.91,72,{"ext":19,"url":1278,"hash":1279,"mime":20,"name":1280,"path":16,"size":1281,"width":838,"height":1238},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Large_Data_Port_Logo_e13a318ba1.png","medium_Large_Data_Port_Logo_e13a318ba1","medium_LargeDataPortLogo.png",26.84,{"ext":19,"url":1283,"hash":1284,"mime":20,"name":1285,"path":16,"size":1286,"width":73,"height":691},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Large_Data_Port_Logo_e13a318ba1.png","thumbnail_Large_Data_Port_Logo_e13a318ba1","thumbnail_LargeDataPortLogo.png",8.03,"Large_Data_Port_Logo_e13a318ba1","https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Large_Data_Port_Logo_e13a318ba1.png","2025-05-19T15:49:59.536Z",{"id":436,"variation":39,"button":1291},[1292],{"id":568,"label":82,"size":43,"color":44,"style":16,"icon":45,"iconPosition":46,"url":1293,"newWindow":8,"downloadable":16,"shape":16},"https://ieee-dataport.org/","-167",{"pagination":1296},{"page":5,"pageSize":177,"pageCount":5,"total":96},{"id":491,"heading":486,"pageHeader":1298,"sections":1300},{"id":491,"description":1299,"showPageHeader":8,"backgroundColor":98,"image":16},"Tuesday, June 24, 2025",[1301],{"id":391,"__component":1302,"componentVariation":1303,"contactsVariation":1304,"styles":16,"header":16,"sessionsGroup":1305},"content.sessions","Sessions Base","Card Contact Full",[1306],{"id":183,"groupTitle":16,"sessions":1307},[1308,1360,1397,1431,1484,1520,1561],{"id":770,"session":1309},{"id":342,"title":1310,"teaser":1311,"body":1312,"createdAt":1313,"updatedAt":1314,"publishedAt":1315,"url_path_id":1316,"contacts":1317,"url_path":1359},"SHINE’s Role in Advancing Singapore’s Semiconductor Landscape","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">8:30-8:45\u003C/h4>\u003Cp style=\"text-align:justify;\">By working across NUS, NTU, A*STAR-IME, DSO National Labs, and SIMTech, the Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) Centre, hosted at the NUS College of Design and Engineering, seeds a National Heterogeneous Integration pilot line locally that is capable of unique \"Mix-&-Match\" hybrid electronic technologies. \u003C/p>","\u003Cp style=\"text-align:justify;\">At the intersection of materials science, electronics, and photonics, the Centre brings together researchers across disciplines to develop advanced microelectronics, including flexible electronics, with an emphasis on real-world impact. As a platform for academic-industry collaboration, SHINE enables partners across the semiconductor value chain to co-develop and translate emerging technologies into practical applications. By advancing heterogeneous integration capabilities and hybrid-integrated technologies, SHINE plays a pivotal role in propelling Singapore's semiconductor industry forward, driving innovation, and solidifying the country's position as a key player in the global microelectronics landscape.\u003C/p>","2025-06-06T13:36:51.756Z","2025-06-06T13:38:23.533Z","2025-06-06T13:36:53.533Z","226",[1318],{"id":151,"name":1319,"committee":16,"position":16,"affiliation":104,"email":16,"biography":1320,"createdAt":1321,"updatedAt":1322,"url_path_id":1323,"contactPhoto":1324,"socialLinks":1357,"url_path":1358},"Yeow Kheng Lim","\u003Cp style=\"text-align:justify;\">Prof. Lim Yeow Kheng is the Programme Director of the SHINE Centre and the Master of Science in Semiconductor Technology and Operations (STO) programme at the National University of Singapore (NUS). He also serves as Assistant Dean (Research and Technology) and Professor in the Department of Electrical and Computer Engineering at the College of Design and Engineering. With over 20 years of industry experience in semiconductor technology and OSAT manufacturing, Prof. Lim has held leadership roles at GlobalFoundries and JCET Group. His research interests span advanced wafer-level packaging, heterogeneous integration, nanomaterials, flexible electronics, and AI/ML applications. He is a Senior Member of IEEE, holds multiple patents, and is active in numerous local and international technical committees and conferences in microelectronics and packaging technologies.\u003C/p>","2024-10-28T20:07:18.003Z","2025-06-16T22:27:38.649Z","22",{"id":1325,"name":1326,"alternativeText":16,"caption":16,"width":1327,"height":1328,"formats":1329,"hash":1353,"ext":819,"mime":822,"size":1354,"url":1355,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1356,"updatedAt":1356},199,"Prof Lim Yeow Kheng's photo.jpg",3240,4320,{"large":1330,"small":1335,"medium":1341,"thumbnail":1347},{"ext":819,"url":1331,"hash":1332,"mime":822,"name":1333,"path":16,"size":1334,"width":838,"height":825},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2.jpg","large_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2","large_Prof Lim Yeow Kheng's photo.jpg",54.81,{"ext":819,"url":1336,"hash":1337,"mime":822,"name":1338,"path":16,"size":1339,"width":1340,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2.jpg","small_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2","small_Prof Lim Yeow Kheng's photo.jpg",17.04,375,{"ext":819,"url":1342,"hash":1343,"mime":822,"name":1344,"path":16,"size":1345,"width":1346,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2.jpg","medium_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2","medium_Prof Lim Yeow Kheng's photo.jpg",32.41,563,{"ext":819,"url":1348,"hash":1349,"mime":822,"name":1350,"path":16,"size":1351,"width":1352,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2.jpg","thumbnail_Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2","thumbnail_Prof Lim Yeow Kheng's photo.jpg",3.33,117,"Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2",1128.47,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Prof_Lim_Yeow_Kheng_s_photo_ba670d97a2.jpg","2025-06-16T22:27:35.493Z",[],"-12","-185",{"id":348,"session":1361},{"id":449,"title":1362,"teaser":1363,"body":1364,"createdAt":1365,"updatedAt":1366,"publishedAt":1367,"url_path_id":1368,"contacts":1369,"url_path":1396},"Unleashing Power of Advanced Packaging with Smart Manufacturing","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>8:45-9:15\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">This keynote explores how the semiconductor industry is advancing toward the next frontier of innovation through cutting-edge smart manufacturing capabilities that are reshaping advanced packaging. As packaging complexity increases, the industry is embracing a new paradigm that combines system-level codesign, predictive modeling, advanced process controls, and digital twin technologies.\u003C/p>","\u003Cp style=\"text-align:justify;\">Attendees will gain insight into how these capabilities are transforming manufacturing into a more intelligent, adaptive, and efficient ecosystem. We will examine how predictive simulations and digital twins are enabling virtual qualification, enhancing quality and consistency, and driving predictive maintenance. The session will also highlight how smart manufacturing is becoming a cornerstone of Industry 4.0, unlocking new levels of agility and performance in semiconductor production.\u003C/p>","2025-05-27T19:19:33.898Z","2025-05-27T19:39:20.680Z","2025-05-27T19:19:35.473Z","219",[1370],{"id":1371,"name":1372,"committee":16,"position":16,"affiliation":944,"email":16,"biography":1373,"createdAt":1374,"updatedAt":1374,"url_path_id":1375,"contactPhoto":1376,"socialLinks":1394,"url_path":1395},118,"Chris Sim","\u003Cp style=\"text-align:justify;\">Chris Sim serves as the Director of Package Development Engineering (PDE) at Micron Technology, where he spearheads strategic initiatives across HBM, NAND, and DRAM technologies. In this role, he leads advanced packaging, technology development, package integration, industrial engineering, digital twin implementation, and key equipment teams—accelerating innovation and the deployment of next-generation silicon technodes.\u003C/p>\u003Cp style=\"text-align:justify;\">Chris joined Micron in 2015 as a product engineer focused on SSD and module solutions. Since then, he has earned recognition for his deep technical expertise and cross-functional leadership, playing a pivotal role in advancing Micron’s memory and storage innovations.\u003C/p>\u003Cp style=\"text-align:justify;\">He holds a Bachelor’s degree in Electronics Engineering with a specialization in Bio-instrumentation from Multimedia University, Malaysia (2010), and an MBA from Singapore Management University (2021), equipping him with a strong blend of technical insight and business strategy.\u003C/p>","2025-05-27T19:18:46.360Z","218",{"id":67,"name":1377,"alternativeText":16,"caption":16,"width":1378,"height":1378,"formats":1379,"hash":1390,"ext":819,"mime":822,"size":1391,"url":1392,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1393,"updatedAt":1393},"Chris Sim.jpg",648,{"small":1380,"thumbnail":1385},{"ext":819,"url":1381,"hash":1382,"mime":822,"name":1383,"path":16,"size":1384,"width":66,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Chris_Sim_5c9c665070.jpg","small_Chris_Sim_5c9c665070","small_Chris Sim.jpg",18.76,{"ext":819,"url":1386,"hash":1387,"mime":822,"name":1388,"path":16,"size":1389,"width":1212,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Chris_Sim_5c9c665070.jpg","thumbnail_Chris_Sim_5c9c665070","thumbnail_Chris Sim.jpg",3.58,"Chris_Sim_5c9c665070",26.21,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Chris_Sim_5c9c665070.jpg","2025-05-27T19:18:44.348Z",[],"-179","-180",{"id":685,"session":1398},{"id":649,"title":1399,"teaser":1400,"body":1401,"createdAt":1402,"updatedAt":1403,"publishedAt":1404,"url_path_id":1405,"contacts":1406,"url_path":1430},"Robust, Easy to Integrate Z-Axis Interconnect for Flexible Hybrid Electronics","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>9:15-9:45\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">Flexible Hybrid Electronics are comprised of soft and rigid electronic components. Robust and reliable electrical interconnections are necessary to ensure the proper functionality of the devices with rigid semiconductors, communications, and sensor components on flexible circuits. ZTACH® ACE, magnetically aligned Anisotropic Conductive Epoxy (ACE) takes advantage of magnetically induced self-assembly of ferro-magnetic particles that self-align into Z-axis “wires” in an epoxy polymer matrix optimized for Flexible Hybrid Electronic (FHE) applications.  \u003C/p>","\u003Cp style=\"text-align:justify;\">ZTACH® ACE provides a high-reliability electrical and mechanical interconnection without requiring precise patterning, high heat, or pressure. This magnetically aligned conductive epoxy cures at low temperatures (80C-160C) and supports fine-pitch (100 microns) reliably while maintaining low contact resistance and strong mechanical bond strength. Additionally, ZTACH® ACE acts as its own underfill and edge encapsulant, eliminating the need for a separate underfill step.  Importantly, ZTACH® ACE integrates seamlessly into traditional Surface Mount Technology (SMT) lines, enabling efficient, high-volume production. \u003C/p>\u003Cp style=\"text-align:justify;\">SunRay will present several case studies of this novel adhesive technology using various demonstration vehicles, showcasing results of rigorous electrical and mechanical testing. Example applications to be discussed include flipped bare die attachment on flexible circuits, replacing wire-bonding, and dam and fill assembly on rigid boards. ZTACH® ACE bonding enables lower profile component attachment on flexible substrates for smart labels, allowing the addition of security features or integrated sensing, while decreasing costs and meeting performance requirements. Further case studies include the use of ZTACH® ACE in typical wearable electronic applications on host substrates like textiles and TPU, without the addition of underfill and/or encapsulation. This magnetically aligned adhesive is compatible with existing SMT lines, making adoption for manufacturing a low cost, easily adaptable technology. An Ultra Violet (UV) curable version under development is garnering interest in roll-to-roll flexible assemblies. \u003C/p>\u003Cp style=\"text-align:justify;\">The goal of this talk will be to demonstrate the possibilities of transitioning rigid products to FHE systems using a novel magnetically aligned ACE with existing SMT infrastructure. Easier, lower cost manufacturing of robust, flexible, wearable FHEs can be integrated into a wider range of cost effective, reliable end use applications. \u003Cbr> \u003C/p>","2025-05-22T14:03:57.354Z","2025-05-27T19:38:04.766Z","2025-05-22T14:03:59.490Z","206",[1407],{"id":382,"name":1408,"committee":16,"position":16,"affiliation":1409,"email":16,"biography":1410,"createdAt":1411,"updatedAt":1412,"url_path_id":1413,"contactPhoto":1414,"socialLinks":1428,"url_path":1429},"Madhu Stemmermann","SunRay Scientific Inc","\u003Cp style=\"text-align:justify;\">Madhu Stemmermann serves as the CEO and Co-Founder of SunRay Scientific Inc. Madhu has 25 years of experience in executive leadership roles across manufacturing, supply chain, sales and product management spanning various industries such as electronics packaging, conductive adhesives, medical devices, LED lighting and engineered plastics.  She was the youngest and first female Plant Manager appointed at Philips Lighting.  She has led and executed various company transformations and acquisitions.  Madhu received her degree in Chemical Engineering from Purdue University, West Lafayette, IN. \u003C/p>","2025-05-22T14:03:08.690Z","2025-06-16T22:28:55.553Z","205",{"id":832,"name":1415,"alternativeText":16,"caption":16,"width":1416,"height":1417,"formats":1418,"hash":1424,"ext":819,"mime":822,"size":1425,"url":1426,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1427,"updatedAt":1427},"Picture1.jpg",366,486,{"thumbnail":1419},{"ext":819,"url":1420,"hash":1421,"mime":822,"name":1422,"path":16,"size":1423,"width":1352,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Picture1_f628c028ec.jpg","thumbnail_Picture1_f628c028ec","thumbnail_Picture1.jpg",3.41,"Picture1_f628c028ec",21.23,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Picture1_f628c028ec.jpg","2025-05-22T14:03:05.361Z",[],"-168","-169",{"id":389,"session":1432},{"id":389,"title":1433,"teaser":1434,"body":1435,"createdAt":1436,"updatedAt":1437,"publishedAt":1438,"url_path_id":1439,"contacts":1440,"url_path":1483},"Automotive FPC display interfaces – Modelling and Validation","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>9:45-10:15\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">Continental Automotive develops pioneering technologies and services for sustainable and connected mobility of people and their goods. It offers safe, efficient, intelligent, and affordable solutions for vehicles, machines, traffic, and transportation. Our pioneering technologies for visual, tactile, and auditory interaction with the vehicle determine the mobility of the future.\u003C/p>","\u003Cp style=\"text-align:justify;\">In this presentation, we will give an overview about automotive display interfaces design and challenges associated with those interfaces. These interfaces use FPC/FFC cables along with FPC display boards. Flexible PCBs can be folded or shaped to fit into compact or irregular spaces, making them ideal for modern vehicles. To have the flexibility, they need to have thin cores and special ground structures that can create significant SI (Signal Integrity) and EMC (Electro Magnetic Compatibility) issues. Simulations helps here to model these flex PCB’s up front and resolve the issues regarding the SI and EMC early and helps in achieving superior quality and cost-efficient design. \u003C/p>","2025-04-14T14:14:57.664Z","2025-05-27T19:37:18.206Z","2025-04-14T14:14:59.503Z","172",[1441],{"id":17,"name":1442,"committee":16,"position":16,"affiliation":1443,"email":16,"biography":1444,"createdAt":1445,"updatedAt":1446,"url_path_id":1447,"contactPhoto":1448,"socialLinks":1481,"url_path":1482},"Kalivaraprasad Reddy","Continental Automotive Singapore","\u003Cp style=\"text-align:justify;\">Mr. Kalivaraprasad Reddy Dontireddy is a Senior Expert at Continental Automotive Singapore. Mr. Dontireddy, Kalivaraprasad Reddy started his carrier in 2010 after finishing his master’s degree in Microwave engineering from IIT BHU. He joined Bosch as EMC engineer and later moved to Stuttgart, Germany, where he worked on automotive electronics with a focus on EMC. \u003C/p>\u003Cp style=\"text-align:justify;\">Subsequently, he Joined Visteon and then Cummins as a Technical Specialist in High Speed and EMC simulations domain. He played a key role in developing simulation methods and processes to achieve signal integrity (SI) and EMC compliance.\u003C/p>\u003Cp style=\"text-align:justify;\">In 2017, he relocated to Singapore to work at Continental Automotive where he currently serves as a Senior Expert in high-speed design and EMC simulation. He has extensive experience in designing memory interfaces like LPDDR4 along with display interfaces like LVDS and eDP etc. Additionally, he has developed methodologies for in-house FPC designs with special ground structures to meet SI and EMC requirements. His research interests include exploring alternative techniques for achieving EMC compliance and leveraging AI in high-speed design.\u003Cbr> \u003C/p>","2025-04-14T14:13:56.995Z","2025-06-16T22:29:14.869Z","171",{"id":580,"name":1449,"alternativeText":16,"caption":16,"width":1450,"height":1451,"formats":1452,"hash":1477,"ext":819,"mime":822,"size":1478,"url":1479,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1480,"updatedAt":1480},"Kalivaraprasad.jpg",1805,2266,{"large":1453,"small":1459,"medium":1465,"thumbnail":1471},{"ext":819,"url":1454,"hash":1455,"mime":822,"name":1456,"path":16,"size":1457,"width":1458,"height":825},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Kalivaraprasad_6b5ecbe736.jpg","large_Kalivaraprasad_6b5ecbe736","large_Kalivaraprasad.jpg",101.52,797,{"ext":819,"url":1460,"hash":1461,"mime":822,"name":1462,"path":16,"size":1463,"width":1464,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Kalivaraprasad_6b5ecbe736.jpg","small_Kalivaraprasad_6b5ecbe736","small_Kalivaraprasad.jpg",23.78,398,{"ext":819,"url":1466,"hash":1467,"mime":822,"name":1468,"path":16,"size":1469,"width":1470,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Kalivaraprasad_6b5ecbe736.jpg","medium_Kalivaraprasad_6b5ecbe736","medium_Kalivaraprasad.jpg",55.25,597,{"ext":819,"url":1472,"hash":1473,"mime":822,"name":1474,"path":16,"size":1475,"width":1476,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Kalivaraprasad_6b5ecbe736.jpg","thumbnail_Kalivaraprasad_6b5ecbe736","thumbnail_Kalivaraprasad.jpg",3.61,124,"Kalivaraprasad_6b5ecbe736",565.16,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Kalivaraprasad_6b5ecbe736.jpg","2025-04-14T14:12:48.974Z",[],"-141","-142",{"id":316,"session":1485},{"id":751,"title":1486,"teaser":1487,"body":1488,"createdAt":1489,"updatedAt":1490,"publishedAt":1491,"url_path_id":1492,"contacts":1493,"url_path":1519},"The Latest Technology Breakthroughs for Flexible Printed OLED TV Display Technology","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">11:35-12:05\u003C/h4>\u003Cp style=\"text-align:justify;\">The flexible printed OLED TV display technology will be able to create new application market, such as rollable/foldable TV, in the future. It’s TV Mobiles. The flexible printed OLED TV Mobiles, combined with touch/camera technology, ubiquitous connectivity through 5G/6G technology, and with the integration of Iot/healthcare sensors on the flexible printed OLED TV Mobiles panel, and with the help of AI, Big Data and iCloud, will change our daily life into a smart way of thinking, living, and working. TCL believes that this kind of TV Mobiles will be a “Disruptive Game Changer” in the display industry in near the future. \u003C/p>","\u003Cp style=\"text-align:justify;\">Since the TCL (TCL CSOT, Guangdong Juhua Printed Display Technology Co. Ltd. & TCL Corporate Research) has successfully demonstrated the 31” FHD flexible printed OLED TV, there are a lot of technology breakthroughs for improving the panel performance and cost reduction. The co-planar top gate Oxide TFT device architecture, printing OLED top emission device architecture with new OLED materials, MURA free ink jet printing technology with unique bank design, advanced encapsulation technology with new inorganic material for panel performance improvement are developed. Especially innovative mechanical release technology without using laser lift off technology is developed for cost reduction and production yield up in flexible printed OLED TV MP line. Based on these technology breakthroughs, 31” 4K flexible printed OLED TV with high resolution(142ppi) are fabricated. \u003C/p>\u003Cp style=\"text-align:justify;\">The performance of 31” flexible printed OLED TV is, 4K high resolution (3840x2160, 142ppi), luminance: FW 150nits, excellent C/R; > 1M:1, color gamut: DCI-P3: >99%, wide viewing angle (△u’v’ < 0.02): ≥ +/- 45°, A/R: 47.75%, and curvature radius:  20mm\u003C/p>\u003Cp style=\"text-align:justify;\">In this paper, the panel performance of 31” 4K high resolution flexible printed OLED TV and the latest technology breakthroughs are discussed in details.  \u003Cbr> \u003C/p>","2025-06-05T15:12:33.482Z","2025-06-05T15:13:18.025Z","2025-06-05T15:12:38.435Z","225",[1494],{"id":1495,"name":1496,"committee":16,"position":16,"affiliation":1497,"email":16,"biography":1498,"createdAt":1499,"updatedAt":1500,"url_path_id":1501,"contactPhoto":1502,"socialLinks":1517,"url_path":1518},121,"James (Jueng-Gil) Lee","TCL Corporate Research","\u003Cp style=\"text-align:justify;\">Dr. James Lee serves as the Deputy Chief Engineer at TCL Corporate Research. Dr. James Lee’s over 30 years working experience comes from global leading display companies after receiving Ph.D. degree at Tohoku university in Japan, such as Apple in USA (Principal Technologist), LG Display (Research Fellow), Samsung Electronics (Principal Engineer) and CDT in UK (Director) holding fundamental IPs of Polymer OLED material/device architecture/process and is an expert in OLED display manufacturing technology & product development for TV & mobile application. Currently Dr. Lee, Deputy Chief Engineer at TCL Corporate Research since June 2015, is responsible for developing the printing OLED/QLED (Quantum Dots) display technology and innovative flexible display technology development.\u003C/p>","2025-06-05T15:11:22.697Z","2025-06-16T22:29:36.064Z","224",{"id":1503,"name":1504,"alternativeText":16,"caption":16,"width":1505,"height":1506,"formats":1507,"hash":1513,"ext":19,"mime":20,"size":1514,"url":1515,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1516,"updatedAt":1516},194,"unnamed.png",391,291,{"thumbnail":1508},{"ext":19,"url":1509,"hash":1510,"mime":20,"name":1511,"path":16,"size":1512,"width":1211,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_unnamed_091095cd66.png","thumbnail_unnamed_091095cd66","thumbnail_unnamed.png",57.62,"unnamed_091095cd66",54.87,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/unnamed_091095cd66.png","2025-06-05T15:11:19.553Z",[],"-183","-184",{"id":342,"session":1521},{"id":429,"title":1522,"teaser":1523,"body":1524,"createdAt":1525,"updatedAt":1526,"publishedAt":1527,"url_path_id":1528,"contacts":1529,"url_path":1560},"Advancing Manufacturing in Flexible Hybrid Electronics through Innovation and Design","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>12:05-12:35\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">Flexible Hybrid Electronics represents the forefront of technology, combining the flexibility of printed electronics with the performance of traditional semiconductor components to create lightweight, bendable, and adaptable electronic systems with enhanced functionality.\u003C/p>","\u003Cp style=\"text-align:justify;\">As the flexible hybrid electronics market needs shift to additive printing, reduced paste metal content, and lower processing temperatures, it is required to develop direct write technologies to meet these technical targets. Ability to influence the electronic structure and material properties such particle morphology, aspect ratio, conductivity, adhesion and residual organic content is critical for robust functioning of the end-product. The talk will delve into the developments and advancements in flexible hybrid electronics, with a specific focus on emerging applications in advanced packaging and healthcare applications.\u003C/p>","2025-05-27T14:23:05.442Z","2025-05-27T19:38:45.035Z","2025-05-27T14:23:08.376Z","214",[1530],{"id":1531,"name":1532,"committee":16,"position":16,"affiliation":1533,"email":16,"biography":1534,"createdAt":1535,"updatedAt":1535,"url_path_id":1536,"contactPhoto":1537,"socialLinks":1558,"url_path":1559},114,"Sudheer Kumar","Indian Institute of Technology Kanpur, India","\u003Cp style=\"text-align:justify;\">Dr. Sudheer Kumar is presently working as COO, National Centre for Flexible Electronics, IIT Kanpur. He has over 24 years of experience in working academics and industries mainly in Solar Energy, Displays, Semiconductor and Electronics Industries spanning across globally. He has earlier served many key top positions in various industrial organizations and some of them are - Flisom AG, Switzerland, Tata Industries Ltd, Moserbaer Solar Ltd. and SAMTEL Color Ltd. His main contributions belong to the areas of project conceptualization, Operations, Supply Chain Management, Business development / management, Evaluation of many companies, Technology Transfers, value engineering and startup projects with chronicle success of driving benchmarks, setting-up growth and expansion for reputed organizations. His main areas of interests / specialization are – Organic Semiconductor, Flexible Electronics, Flexible Solar, Smart Packaging, Displays, Large Fab Engineering and Operations.\u003C/p>","2025-05-27T14:22:02.751Z","213",{"id":1538,"name":1539,"alternativeText":16,"caption":16,"width":1540,"height":1541,"formats":1542,"hash":1554,"ext":819,"mime":822,"size":1555,"url":1556,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1557,"updatedAt":1557},183,"Photo --Dr Sudheer Kumar .jpg",596,470,{"small":1543,"thumbnail":1549},{"ext":819,"url":1544,"hash":1545,"mime":822,"name":1546,"path":16,"size":1547,"width":66,"height":1548},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Photo_Dr_Sudheer_Kumar_4ea5c9673b.jpg","small_Photo_Dr_Sudheer_Kumar_4ea5c9673b","small_Photo --Dr Sudheer Kumar .jpg",17.01,394,{"ext":819,"url":1550,"hash":1551,"mime":822,"name":1552,"path":16,"size":1553,"width":678,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Photo_Dr_Sudheer_Kumar_4ea5c9673b.jpg","thumbnail_Photo_Dr_Sudheer_Kumar_4ea5c9673b","thumbnail_Photo --Dr Sudheer Kumar .jpg",4.48,"Photo_Dr_Sudheer_Kumar_4ea5c9673b",12.46,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Photo_Dr_Sudheer_Kumar_4ea5c9673b.jpg","2025-05-27T14:21:49.113Z",[],"-174","-175",{"id":370,"session":1562},{"id":370,"title":1563,"teaser":1564,"body":1565,"createdAt":1566,"updatedAt":1567,"publishedAt":1568,"url_path_id":1569,"contacts":1570,"url_path":1594},"The Challenge of current stretchable PCB and the fabrication Approach","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>12:35-13:05\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">For this talk, Mr. Shimizu will discuss the stretchable Printed Circuit Board (PCB) that incorporates the use of liquid metal to enhance flexibility, a fabrication approach with potential for high-volume production, and social implementation. \u003C/p>","\u003Cp style=\"text-align:justify;\">At Satosen, Mr. Shimizu and his team fabricated PCBs with liquid metal channels in an elastomer, achieving high durability and reliable electrical conductivity. The study showcases the fabrication process, electrical performance under strain, and mechanical robustness. The results show the potential of the above-mentioned approach for use in wearable electronics and flexible sensors. Key findings include long-term performance. This work represents a step forward in the advancement of highly deformable electronic devices.\u003C/p>","2025-04-07T19:15:34.249Z","2025-05-27T19:36:43.667Z","2025-04-07T19:15:35.601Z","157",[1571],{"id":1572,"name":1573,"committee":16,"position":16,"affiliation":1574,"email":16,"biography":1575,"createdAt":1576,"updatedAt":1577,"url_path_id":1578,"contactPhoto":1579,"socialLinks":1592,"url_path":1593},91,"Shimizu Ryota","Satosen Corporation, Japan","\u003Cp style=\"text-align:justify;\">Mr. Ryota Shimizu is the Chief of R&D in the Engineering Department at Satosen Corporation. Born in Kobe, Japan, in 1985, Shimizu Ryota embarked on a career path that seamlessly blends international business acumen with cutting-edge technological innovation. His journey began at Satosen, where he excelled as an international sales representative, building valuable relationships and navigating the complexities of global commerce. This experience provided him with a strong foundation in understanding diverse customer needs and market dynamics.\u003Cbr>Driven by a passion for innovation, Shimizu transitioned to Satosen's Research and Development department. Here, he focused on the development of next-generation printed circuit boards (PCBs), with a particular emphasis on stretchable PCBs. This groundbreaking technology holds immense potential for various applications, from wearable electronics to flexible sensors.\u003Cbr>Shimizu's work in R&D involved close collaboration with a diverse range of customers, guiding projects from initial conception to mass production. This experience honed his ability to translate technical concepts into practical solutions, bridging the gap between research and real-world applications. He also dedicated himself to researching stretchable PCBs that utilize liquid metal, a field that is at the very forefront of electronic flexibility.\u003Cbr>Shimizu Ryota's career is defined by a commitment to pushing the boundaries of technology and fostering collaboration. His dedication to developing and implementing innovative solutions, particularly in the realm of stretchable PCBs, positions him as a key contributor to the advancement of flexible electronics.\u003Cbr> \u003C/p>","2025-04-05T00:38:17.116Z","2025-06-16T22:29:51.951Z","150",{"id":401,"name":1580,"alternativeText":16,"caption":16,"width":1581,"height":1581,"formats":1582,"hash":1588,"ext":819,"mime":822,"size":1589,"url":1590,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1591,"updatedAt":1591},"Shimizu Ryota.jpg",359,{"thumbnail":1583},{"ext":819,"url":1584,"hash":1585,"mime":822,"name":1586,"path":16,"size":1587,"width":1212,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Shimizu_Ryota_76b873a856.jpg","thumbnail_Shimizu_Ryota_76b873a856","thumbnail_Shimizu Ryota.jpg",6.09,"Shimizu_Ryota_76b873a856",23.96,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Shimizu_Ryota_76b873a856.jpg","2025-04-05T00:37:42.776Z",[],"-123","-128",{"data":1596,"meta":1597},{"id":491,"heading":486,"createdAt":492,"updatedAt":493,"publishedAt":494,"url_path_id":495,"url_path":487,"contentType":123},{},1778852370386]