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DataPort","2025-05-19T15:50:25.567Z","2025-05-19T15:51:19.719Z","2025-05-19T15:50:27.934Z","203",{"id":284,"name":1263,"alternativeText":16,"caption":16,"width":1264,"height":987,"formats":1265,"hash":1287,"ext":19,"mime":20,"size":1179,"url":1288,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1289,"updatedAt":1289},"LargeDataPortLogo.png",1002,{"large":1266,"small":1271,"medium":1277,"thumbnail":1282},{"ext":19,"url":1267,"hash":1268,"mime":20,"name":1269,"path":16,"size":1270,"width":825,"height":987},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Large_Data_Port_Logo_e13a318ba1.png","large_Large_Data_Port_Logo_e13a318ba1","large_LargeDataPortLogo.png",33.51,{"ext":19,"url":1272,"hash":1273,"mime":20,"name":1274,"path":16,"size":1275,"width":66,"height":1276},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Large_Data_Port_Logo_e13a318ba1.png","small_Large_Data_Port_Logo_e13a318ba1","small_LargeDataPortLogo.png",16.91,72,{"ext":19,"url":1278,"hash":1279,"mime":20,"name":1280,"path":16,"size":1281,"width":838,"height":1238},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Large_Data_Port_Logo_e13a318ba1.png","medium_Large_Data_Port_Logo_e13a318ba1","medium_LargeDataPortLogo.png",26.84,{"ext":19,"url":1283,"hash":1284,"mime":20,"name":1285,"path":16,"size":1286,"width":73,"height":691},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Large_Data_Port_Logo_e13a318ba1.png","thumbnail_Large_Data_Port_Logo_e13a318ba1","thumbnail_LargeDataPortLogo.png",8.03,"Large_Data_Port_Logo_e13a318ba1","https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Large_Data_Port_Logo_e13a318ba1.png","2025-05-19T15:49:59.536Z",{"id":436,"variation":39,"button":1291},[1292],{"id":568,"label":82,"size":43,"color":44,"style":16,"icon":45,"iconPosition":46,"url":1293,"newWindow":8,"downloadable":16,"shape":16},"https://ieee-dataport.org/","-167",{"pagination":1296},{"page":5,"pageSize":177,"pageCount":5,"total":96},{"id":376,"heading":371,"pageHeader":1298,"sections":1299},{"id":376,"description":16,"showPageHeader":8,"backgroundColor":98,"image":16},[1300],{"id":112,"__component":1301,"componentVariation":1302,"contactsVariation":1303,"styles":16,"header":16,"sessionsGroup":1304},"content.sessions","Sessions Base","Card Contact Full",[1305,1356,1398,1443,1482,1519,1556,1593,1642,1692],{"id":112,"groupTitle":1306,"sessions":1307},"Track 1: Emerging Materials",[1308],{"id":391,"session":1309},{"id":391,"title":1310,"teaser":1311,"body":1312,"createdAt":1313,"updatedAt":1314,"publishedAt":1315,"url_path_id":1316,"contacts":1317,"url_path":1355},"Two-Dimensional Semiconductors for Advanced Electronics ","\u003Cp style=\"text-align:justify;\">With the scaling of dimensions, the control of transistor gates weakens due to increased source-drain tunneling. Therefore, reducing the thickness of the transistor body is necessary to ensure effective electrostatic control. The utilization of new materials such as \"ultra-thin\" 2D semiconducting materials has garnered attention. \u003C/p>","\u003Cp style=\"text-align:justify;\">In this presentation, I aim to provide an analysis and rationale regarding the potential for scaling device dimensions, potentially down to the 1nm technology node, utilizing 2D transition metal dichalcogenides (TMD) semiconductors. From a circuit perspective, I will share our insights on benchmarking 2D-based circuits against state-of-the-art Si FinFETs, using SRAM circuits as a case study to highlight the advantages of employing 2D materials over Si FinFET (or GAA) in technology nodes ranging from N16 down to N1. Furthermore, we will discuss the most critical defect issues in the material growth of 2D semiconductors, how to develop high-quality 2D semiconductors that meet future electronics needs, and several key issues in transistor fabrication, including metal contacts, high-k dielectric layers, and the progress of related research. \u003C/p>","2025-02-10T23:02:26.964Z","2025-03-03T20:33:34.462Z","2025-02-10T23:02:28.659Z","105",[1318],{"id":1319,"name":1320,"committee":16,"position":16,"affiliation":1321,"email":16,"biography":1322,"createdAt":1323,"updatedAt":1324,"url_path_id":1325,"contactPhoto":1326,"socialLinks":1353,"url_path":1354},67,"Lain-Jong (Lance) Li","NUS, Singapore","\u003Cp style=\"text-align:justify;\">Prof. Li is a Distinguished Professor in the Department of Materials Science and Engineering at National University of Singapore, He also serves as an Associate Editor for Nano Letters (ACS).\u003C/p>\u003Cp style=\"text-align:justify;\">Professor Lain-Jong (Lance) Li received his BSc and MSc in chemistry at National Taiwan University. He obtained his PhD of condensed matter physics at Oxford University in 2006 with the support of Swire Scholarship. He then joined Nanyang Technological University Singapore as an Assistant Professor from 2006 to 2009. Since 2010, he has become an Associate Professor at Academia Sinica Taiwan. He joined King Abdullah University of Science and Technology in 2014 and became a Full Professor in 2016. He then took the Director position in Corporate Research at Taiwan Semiconductor Manufacturing Company (TSMC), from 2017-2020.  He joined the department of mechanical engineering at HKU as a chair professor in nanomaterials for future electronics (2021-2024).\u003C/p>\u003Cp style=\"text-align:justify;\">His research is primarily focusing on solving these grand challenges for extending Moore’s Law and realizing high-performance future electronics.  He has owned more than 40 US patents and more than 15 Taiwanese patents. He is a highly cited scholar (2018-2024) with publication matrix: citation >88000, h-index 138. \u003Cbr> \u003C/p>","2025-02-03T20:52:55.736Z","2025-03-03T20:34:14.453Z","87",{"id":1327,"name":1328,"alternativeText":16,"caption":16,"width":1329,"height":1330,"formats":1331,"hash":1349,"ext":819,"mime":822,"size":1350,"url":1351,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1352,"updatedAt":1352},84,"Prof-Li-Lain-Jong-Lance.jpg",600,800,{"small":1332,"medium":1338,"thumbnail":1344},{"ext":819,"url":1333,"hash":1334,"mime":822,"name":1335,"path":16,"size":1336,"width":1337,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Prof_Li_Lain_Jong_Lance_fe7c2ca5cf.jpg","small_Prof_Li_Lain_Jong_Lance_fe7c2ca5cf","small_Prof-Li-Lain-Jong-Lance.jpg",43.32,375,{"ext":819,"url":1339,"hash":1340,"mime":822,"name":1341,"path":16,"size":1342,"width":1343,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Prof_Li_Lain_Jong_Lance_fe7c2ca5cf.jpg","medium_Prof_Li_Lain_Jong_Lance_fe7c2ca5cf","medium_Prof-Li-Lain-Jong-Lance.jpg",86.15,563,{"ext":819,"url":1345,"hash":1346,"mime":822,"name":1347,"path":16,"size":14,"width":1348,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Prof_Li_Lain_Jong_Lance_fe7c2ca5cf.jpg","thumbnail_Prof_Li_Lain_Jong_Lance_fe7c2ca5cf","thumbnail_Prof-Li-Lain-Jong-Lance.jpg",117,"Prof_Li_Lain_Jong_Lance_fe7c2ca5cf",95.81,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Prof_Li_Lain_Jong_Lance_fe7c2ca5cf.jpg","2025-02-03T20:52:44.388Z",[],"-69","-86",{"id":28,"groupTitle":1357,"sessions":1358},"Track 2: Advanced manufacturing",[1359],{"id":409,"session":1360},{"id":409,"title":1361,"teaser":1362,"body":50,"createdAt":1363,"updatedAt":1364,"publishedAt":1365,"url_path_id":1366,"contacts":1367,"url_path":1397},"Optimization of Sintering Conditions for Screen-Printed Copper Circuits on Polyimide Substrates for Flexible Electronics Applications","\u003Cp style=\"text-align:justify;\">This study investigates the sintering behavior of screen-printed copper ink on Kapton® HN polyimide film under varying temperature and time conditions to achieve optimal electrical performance. Sintering was conducted at temperatures ranging from 240°C to 300°C. The sheet resistance of the sintered samples was measured using a fourpoint probe system, while surface morphology and microstructural characteristics were analyzed using laser confocal microscopy, scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The results demonstrated that excessive oxidation at high temperatures increased sheet resistance, whereas insufficient densification at lower temperatures hindered conductivity. Optimized sintering conditions were determined to be 250°C for 120 seconds, with a measured sheet resistance of 5.2 mΩ/□, maximizing the balance between oxidation and ink densification. This work offers valuable insights into the sintering optimization of printed copper inks, facilitating advancements in flexible sensors, wearable sensing devices, and hybrid printed electronics.\u003C/p>","2025-02-10T23:02:48.117Z","2025-06-16T02:03:02.722Z","2025-02-10T23:02:49.868Z","106",[1368],{"id":1369,"name":1370,"committee":16,"position":16,"affiliation":1371,"email":16,"biography":50,"createdAt":1372,"updatedAt":1373,"url_path_id":1374,"contactPhoto":1375,"socialLinks":1395,"url_path":1396},74,"Martin Bolduc","University of Quebec, Canada","2025-02-10T22:53:58.057Z","2025-02-10T22:54:51.652Z","99",{"id":1376,"name":1377,"alternativeText":16,"caption":16,"width":1378,"height":1379,"formats":1380,"hash":1391,"ext":819,"mime":822,"size":1392,"url":1393,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1394,"updatedAt":1394},90,"U1294_martin_bolduc_2.jpg",379,506,{"small":1381,"thumbnail":1386},{"ext":819,"url":1382,"hash":1383,"mime":822,"name":1384,"path":16,"size":1385,"width":1337,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_U1294_martin_bolduc_2_3233fa1fcb.jpg","small_U1294_martin_bolduc_2_3233fa1fcb","small_U1294_martin_bolduc_2.jpg",29.72,{"ext":819,"url":1387,"hash":1388,"mime":822,"name":1389,"path":16,"size":1390,"width":1348,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_U1294_martin_bolduc_2_3233fa1fcb.jpg","thumbnail_U1294_martin_bolduc_2_3233fa1fcb","thumbnail_U1294_martin_bolduc_2.jpg",4.61,"U1294_martin_bolduc_2_3233fa1fcb",30.26,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/U1294_martin_bolduc_2_3233fa1fcb.jpg","2025-02-10T22:54:47.766Z",[],"-80","-87",{"id":14,"groupTitle":1399,"sessions":1400},"Track 3: Physical Sensors and Smart Systems",[1401],{"id":431,"session":1402},{"id":431,"title":1403,"teaser":1404,"body":1405,"createdAt":1406,"updatedAt":1407,"publishedAt":1408,"url_path_id":1409,"contacts":1410,"url_path":1442},"Advances in Flexible, Foldable, and Stretchable QLEDs","\u003Cp style=\"text-align:justify;\">Recent advancements in soft electronics have garnered significant attention owing to their potential applications in personalized, mobile, and wearable electronic devices. However, conventional electronic/optoelectronic devices often face challenges due to mechanical mismatches with soft human tissues, resulting in issues such as device fracture under deformation and user discomfort. \u003C/p>","\u003Cp style=\"text-align:justify;\">To address these challenges, ultra-flexible and stretchable electronic/optoelectronic devices with low system modulus and intrinsic softness have been developed. Here, our unique strategies for synthesizing nanoscale materials (e.g., quantum dots, silver nanowires), seamlessly integrating them into patterned arrays, and designing unconventional devices and systems to achieve flexible, foldable, and stretchable quantum dot light-emitting devices are presented. These deformable light-emitting devices can be integrated with stretchable biosensors to form standalone wearable systems, which can create various mobile consumer electronics applications. Recent progresses in soft robotic vision systems and their wearable-display-centric integration potentials can be also briefly discussed. These advancements in electronics/optoelectronics, which combine recent breakthroughs in nanoscale material technologies and unconventional soft electronics, open up many new opportunities.\u003C/p>","2025-02-10T23:03:26.302Z","2025-02-10T23:04:51.631Z","2025-02-10T23:04:20.459Z","107",[1411],{"id":1412,"name":1413,"committee":16,"position":16,"affiliation":1414,"email":16,"biography":1415,"createdAt":1416,"updatedAt":1416,"url_path_id":1417,"contactPhoto":1418,"socialLinks":1440,"url_path":1441},75,"Dae-Hyeong Kim","Seoul National University, Korea","\u003Cp style=\"text-align:justify;\">Dae-Hyeong Kim obtained his B.S. and M.S. degree in Chemical Engineering from Seoul National University, Korea, in 2000 and 2002, respectively. He received his Ph. D. degree in Materials Science and Engineering from University of Illinois at Urbana Champaign in 2009. From 2009 to 2011, he was a post-doctoral research associate at University of Illinois. He joined Seoul National University in 2011 and is currently a professor in School of Chemical and Biological Engineering of Seoul National University. He has been serving as an associate director of Center for Nanoparticle Research of Institute for Basic Science (IBS) from 2017. He has been focusing on the research of nanomaterials and deformable devices and their application to bio-integrated and bio-inspired electronics. He is the Member of National Academy of Engineering of Korea (2024-present), Fellow of American Institute of Medical and Biological Engineering (2025-present), and Fellow of Korean Institute of Chemical Engineers (2020-present). He has been recognized with several awards including George Smith Award (2009), TR 35 award (2011), Hong Jin-ki Creative Award (2015), SCEJ Award (2016), Korea Young Scientist Award (2017), and Prime Minister Commendation of Ministry of Science and ICT of Korea (2023). He was also one of the highly cited researchers by Clarivate Analytics in 2018-2024. He has served as the editors and editorial board members in multiple journals, including the Senior Associate Editor of Science Advances (2024-present).\u003C/p>","2025-02-10T22:56:35.698Z","100",{"id":1419,"name":1420,"alternativeText":16,"caption":16,"width":1421,"height":1422,"formats":1423,"hash":1436,"ext":819,"mime":822,"size":1437,"url":1438,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1439,"updatedAt":1439},91,"Picture1.jpg",460,592,{"small":1424,"thumbnail":1430},{"ext":819,"url":1425,"hash":1426,"mime":822,"name":1427,"path":16,"size":1428,"width":1429,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Picture1_db83c4cb9a.jpg","small_Picture1_db83c4cb9a","small_Picture1.jpg",24.37,389,{"ext":819,"url":1431,"hash":1432,"mime":822,"name":1433,"path":16,"size":1434,"width":1435,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Picture1_db83c4cb9a.jpg","thumbnail_Picture1_db83c4cb9a","thumbnail_Picture1.jpg",3.93,121,"Picture1_db83c4cb9a",32.57,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Picture1_db83c4cb9a.jpg","2025-02-10T22:55:43.208Z",[],"-81","-88",{"id":140,"groupTitle":1444,"sessions":1445},"Track 4: Bio- and Chemical Sensors",[1446],{"id":56,"session":1447},{"id":56,"title":1448,"teaser":1449,"body":1450,"createdAt":1451,"updatedAt":1452,"publishedAt":1453,"url_path_id":1454,"contacts":1455,"url_path":1481},"Electrochemical Biosensing Interface Engineering for  Continuous Biomarker Monitoring Systems","\u003Cp style=\"text-align:justify;\">Wearable biosensors represent a promising opportunity to monitor human physiology through dynamic measurements of (bio)chemical markers in bio-fluids such as sweat, tears, saliva, and interstitial fluid in continuous and non-invasive way. \u003C/p>","\u003Cp style=\"text-align:justify;\">Such new platforms can thus offer real-time (bio)chemical information toward a more comprehensive view of a wearer’s health, performance, or stress at the molecular level in daily life. Continuous biomonitoring addresses the limitations of traditional invasive blood testing and provides the opportunity for early diagnostic and therapeutic interventions. My talk will focus on developing wearable electrochemical biosensors towards non-invasive health monitoring opportunities and evaluating the potential impact of such wearable point-of-care devices on our daily life and clinical settings. It will cover various types of salivary, sweat and tear fluid based wearable biosensors utilizing mouthguard, tattoo patch, and contact lens form-factors. Significant effort have been made on developing enzymatic electrochemical sensors for continuous metabolite monitoring towards healthcare in daily-life or managing diabetes like chronic disease. Recently, we demonstrated personalization strategy for accurate estimation of blood glucose utilizing non-invasive biofluids. Lastly, the talk will also cover the latest efforts on developing small molecule monitoring wearable sensors, focusing on nanoscale molecularly imprinted polymer via quantum electrochemical detection. \u003C/p>","2025-02-10T23:05:14.264Z","2025-02-11T18:29:22.281Z","2025-02-10T23:05:15.642Z","108",[1456],{"id":1457,"name":1458,"committee":16,"position":16,"affiliation":1459,"email":16,"biography":1460,"createdAt":1461,"updatedAt":1462,"url_path_id":1463,"contactPhoto":1464,"socialLinks":1479,"url_path":1480},76,"Jayoung Kim","Yonsei University, Korea","\u003Cp style=\"text-align:justify;\">Jayoung Kim is currently working as an assistant professor in Department of Medical Engineering, College of Medicine at Yonsei University, Korea. Her research interest is in electrochemical biosensing interface for wearable and implantable healthcare devices. She received her BS and Master Degree at Yonsei University and earned PhD degree at UC San Diego under guidance of Prof. Joseph Wang. She continued her research as post-doctoral researcher at Stanford University with Prof. Zhenan Bao. She is the recipient of multiple awards including Korea Loreal UNESCO Female Scientist Fellowship Award and POSCO Science Fellowship in 2023. \u003C/p>","2025-02-10T22:57:26.540Z","2025-03-03T20:32:26.459Z","101",{"id":1465,"name":1466,"alternativeText":16,"caption":16,"width":1467,"height":1468,"formats":1469,"hash":1475,"ext":819,"mime":822,"size":1476,"url":1477,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1478,"updatedAt":1478},115,"Jayoung Photo (1).jpg",327,435,{"thumbnail":1470},{"ext":819,"url":1471,"hash":1472,"mime":822,"name":1473,"path":16,"size":1474,"width":1348,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Jayoung_Photo_1_1baf46d0ae.jpg","thumbnail_Jayoung_Photo_1_1baf46d0ae","thumbnail_Jayoung Photo (1).jpg",3.87,"Jayoung_Photo_1_1baf46d0ae",15.13,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Jayoung_Photo_1_1baf46d0ae.jpg","2025-03-03T20:32:24.019Z",[],"-82","-89",{"id":391,"groupTitle":1483,"sessions":1484},"Track 5: Energy harvesting and Storage",[1485],{"id":534,"session":1486},{"id":534,"title":1487,"teaser":1488,"body":1489,"createdAt":1490,"updatedAt":1491,"publishedAt":1492,"url_path_id":1493,"contacts":1494,"url_path":1518},"The Potential of Ultra-light Weight Organic Photovoltaics for Wearable and Soft Robot Applications","\u003Cp style=\"text-align:justify;\">Extreme thinness can reduce the weight of electronics, significantly decreasing discomfort when worn. Furthermore, it also enhances their mechanical robustness against bending, as the applied strain is determined by the material's softness and device thickness. \u003C/p>","\u003Cp style=\"text-align:justify;\">In a simplified model, film thickness is inversely proportional to strain, meaning that a thinner film experiences less strain for the same bending radius [1]. Additionally, an important benefit when considering photovoltaic devices is that we can expect maximized power output per unit area, which is advantageous for applications where weight is a critical parameter.We focus on improving both the power conversion efficiency (PCE) and the environmental stability of ultra-thin organic solar cells. In this talk, I would like to share recent progress in ultra-thin and lightweight solar cells, as well as their potential applications in wearable devices [2] and soft robotics [3].\u003C/p>\u003Cp>1. K. Fukuda et al., Nat. Energy, 9, 1335-1343 (2024).\u003Cbr>2. L. Sun et al., Sci. Adv. 10, eadk9460 (2024).\u003Cbr>3. Y. Kakei et al., npj Flex. Electron., 6, 78 (2022).\u003Cbr> \u003C/p>","2025-03-04T14:40:40.091Z","2025-03-04T14:40:44.310Z","2025-03-04T14:40:44.299Z","118",[1495],{"id":1496,"name":1497,"committee":16,"position":16,"affiliation":1498,"email":16,"biography":1499,"createdAt":1500,"updatedAt":1500,"url_path_id":1501,"contactPhoto":1502,"socialLinks":1516,"url_path":1517},82,"Kenjiro Fukuda","Osaka University, Japan","\u003Cp style=\"text-align:justify;\">Kenjiro Fukuda received his Ph.D. from the Department of Applied Physics at the University of Tokyo in 2011. Since 2025, he has been a professor in division of Electrical, Electronic and Infocommunications Engineering, Graduate School of Engineering, Osaka University. From 2011 to 2015, he worked at Yamagata University as an assistant professor, and then joined RIKEN from 2015 to 2025 as a Research scientist (2015-2018), and a Senior research scientist (2018-2025) in the thin-film device laboratory and emergent soft system research team, Center for Emergent Matter Science. From 2014 to 2018, he has also been a PRESTO researcher of the Japan Science and Technology Agency. His current research interests include organic solar cells, flexible devices, and printed electronics.\u003C/p>","2025-03-04T14:38:19.681Z","117",{"id":1503,"name":1420,"alternativeText":16,"caption":16,"width":1504,"height":1505,"formats":1506,"hash":1512,"ext":819,"mime":822,"size":1513,"url":1514,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1515,"updatedAt":1515},116,412,459,{"thumbnail":1507},{"ext":819,"url":1508,"hash":1509,"mime":822,"name":1433,"path":16,"size":1510,"width":1511,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Picture1_8fb579ce4a.jpg","thumbnail_Picture1_8fb579ce4a",5.48,140,"Picture1_8fb579ce4a",37.08,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Picture1_8fb579ce4a.jpg","2025-03-04T14:37:58.964Z",[],"-96","-97",{"id":409,"groupTitle":1520,"sessions":1521},"Track 6: Bioresorbable, Green and Low-Power Electronics",[1522],{"id":202,"session":1523},{"id":202,"title":1524,"teaser":1525,"body":1526,"createdAt":1527,"updatedAt":1528,"publishedAt":1529,"url_path_id":1530,"contacts":1531,"url_path":1555},"The Avenue to “Green” in Organic Bioelectronics","\u003Cp style=\"text-align:justify;\">Through its appealing avenues of processing the component devices at room temperature and from low-cost precursor materials, organic electronics has a tremendous potential for the development of products able to achieve the goals of production sustainability as well as environmental and human friendliness for electronics.\u003C/p>","\u003Cp style=\"text-align:justify;\">In an effort to stave off the e-waste growth, the presenter and his research group went further down the path opened by organic electronics research and investigated a large number of biomaterials as substrates, dielectrics, semiconductors and smoothening layers for the fabrication of organic field effect transistors, integrated circuits and organic solar cells. The presentation will focus on the highlights of our recent research, especially with respect to materials investigated, devices fabricated and the immense potential for follow up research: (1) flexible natural and biodegradable substrates; (2) natural dielectrics; (3) bio-origin, H-bonded semiconductors in the families of indigos, anthraquinones and acridones; (4) bio-degradation protocols for organic semiconductors.\u003Cbr>These highlights will be placed in the context of the mountain that one has to climb in order to reach the coveted “green” connotation for electronics, sensors and integrated circuits: (1) biocompatibility issue; (2) biodegradability issue; (3) compostability issue; (4) cost of production / energy expanded in production issue; (5) materials choice issue (carbon foot print); (6) toxicity and the environmental impact of the synthetic avenue for component materials.\u003Cbr>The potential of follow-up research in the green electronics field is immense, with large area electronics fabrication, biomedical implants, bio-sensing and smart labeling, representing only the tip of the iceberg of many more immediate possibilities of high interest for our group. Natural and nature-inspired materials have the unrivalled capability to create “safe-first” electronic markets for human and environment, with minimal or even neutral carbon footprint.\u003C/p>","2025-02-10T23:06:22.678Z","2025-02-10T23:06:25.391Z","2025-02-10T23:06:25.380Z","109",[1532],{"id":1533,"name":1534,"committee":16,"position":16,"affiliation":1535,"email":16,"biography":1536,"createdAt":1537,"updatedAt":1537,"url_path_id":1538,"contactPhoto":1539,"socialLinks":1553,"url_path":1554},77,"Mihai Irimia-Vladu","Johannes Kepler University in Linz, Austria","\u003Cp style=\"text-align:justify;\">Dr. Mihai Irimia-Vladu has been since 2019 University Assistant in the Institute of Physical Chemistry and Linz Institute of Organic Solar Cells of Johannes Kepler University in Linz, Austria, Austria. He was born in Craiova, Romania and obtained his B.S. in Mechanical Engineering from the University of Craiova in 1997. He completed his Ph.D. under the guidance of Prof. Jeffrey W. Fergus in the field of solid-state sensing, at the Materials Engineering Department of Auburn University, Alabama, in May 2006. He moved in July 2006 to Johannes Kepler University in Linz, Austria as post-doctoral fellow, working within the research groups of Prof. Serdar Sariciftci and late Prof. Siegfried Bauer. In Linz, he was the initiator and principal investigator of “green” materials for organic electronics. From 2012 to 2019, Dr. Irimia-Vladu was Senior Scientist at Johanneum Research, Department of Materials in Graz, Austria where he continued his research directions on biomaterials for sustainable circuits, energy conversion and storage, and bio-integrated electronics. Dr. Irimia-Vladu raised in excess of 2 million Euros in external funding, edited 1 book and authored 54 publications in peer reviewed journals, with 13 front cover highlights that received more than 5970 citations for an h-index of 28. He presented his group work through 13 tutorial/keynote, 32 invited presentations at international conferences and 30 seminars at various universities or research centers worldwide. Dr. Irimia-Vladu participated as an external member (opponent) of 4 Ph.D. defenses. For his first worldwide demonstration of “edible electronics”, he was awarded in 2011 the “1st prize of Austrian Society for Environment and Technology” and was named “Austrian of the day” by the regional newspaper in the Upper Austria region. Among scientific discoveries that can be credited to Dr. Irimia-Vladu, is also the first report of semiconducting properties of the historic dye indigo, which helped open a new research field on hydrogen-bonded semiconductors. Dr. Mihai Irimia-Vladu is an active member of American Chemical Society and Materials Research Society and coalesced the emerging field of bioelectronics by co-organizing 5 international meetings, among them 4 Materials Research Society symposia. Dr. Irimia-Vladu’s hobbies include history, literature, hiking, soccer and American football.\u003C/p>","2025-02-10T22:59:32.870Z","102",{"id":74,"name":1540,"alternativeText":16,"caption":16,"width":965,"height":1541,"formats":1542,"hash":1549,"ext":819,"mime":822,"size":1550,"url":1551,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1552,"updatedAt":1552},"Picture2.jpg",208,{"thumbnail":1543},{"ext":819,"url":1544,"hash":1545,"mime":822,"name":1546,"path":16,"size":1547,"width":1548,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Picture2_98698da570.jpg","thumbnail_Picture2_98698da570","thumbnail_Picture2.jpg",3.67,118,"Picture2_98698da570",5.35,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Picture2_98698da570.jpg","2025-02-10T22:59:05.735Z",[],"-83","-90",{"id":431,"groupTitle":1557,"sessions":1558},"Track 7: Hybrid Integration and Advanced Packaging",[1559],{"id":151,"session":1560},{"id":151,"title":1561,"teaser":1562,"body":1563,"createdAt":1564,"updatedAt":1565,"publishedAt":1566,"url_path_id":1567,"contacts":1568,"url_path":1592},"A Three-dimensionally Architected Electronic Skin Mimicking Human Mechanosensation","\u003Cp style=\"text-align:justify;\">Human skin sensing of mechanical stimuli originates from transduction of mechanoreceptors that converts external forces into electrical signals.  While imitating the spatial distribution of those mechanoreceptors can enable developments of electronic skins capable of decoupled sensing of normal/shear forces and strains, it remains elusive.  \u003C/p>","\u003Cp style=\"text-align:justify;\">In this talk, I will introduce a three-dimensionally architected electronic skin (denoted as ‘3DAE-Skin’) with force and strain sensing components arranged in a 3D layout that mimics that of Merkel cells and Ruffini endings in human skin.  This 3DAE-Skin shows excellent decoupled sensing performances of normal force, shear force and strain.  Integration of the 3DAE-Skin with data acquisition/processing modules aided by deep learning algorithms allows development of a tactile system capable of normal/shear force sensing with spatial resolution comparable to human skin, as well as simultaneous modulus and curvature measurements through a simple touch of an object.  Demonstrations include rapid modulus measurements of fruits, bread and cake with various shapes and degrees of freshness. \u003C/p>","2025-02-10T23:08:28.071Z","2025-02-10T23:08:29.592Z","2025-02-10T23:08:29.585Z","110",[1569],{"id":1570,"name":1571,"committee":16,"position":16,"affiliation":1572,"email":16,"biography":1573,"createdAt":1574,"updatedAt":1574,"url_path_id":1575,"contactPhoto":1576,"socialLinks":1590,"url_path":1591},78,"Yihui Zhang","Tsinghua University, China","\u003Cp style=\"text-align:justify;\">Yihui Zhang is a Professor of Engineering Mechanics at Tsinghua University.  His current research interests include mechanically guided 3D assembly, microrobots, bioelectronics, and mechanics of flexible structures.  He has published > 190 peer-reviewed papers in journals including Science, Nature, Science/Nature sister journals, JMPS (the best solid-mechanics journal), and etc, as of January 2025.  He is an inventor on 10 China patents and 3 US patents.  Dr. Zhang is the recipient of several honors and awards, including, Society of Engineering Science’s James R. Rice Medal (2024), NSFC National Science Fund for Distinguished Young Scholars (2022), ASME Gustus L. Larson Memorial Award (2022), The Xplorer Prize (2021), ASME Thomas J.R. Hughes Young Investigator Award (2019), Society of Engineering Science’s Young Investigator Medal (2018), ASME Sia Nemat-Nasser Early Career Award (2018), Eshelby Mechanics Award for Young Faculty (2017), ASME Melville Medal (2017), Qiu Shi Outstanding Young Scholar Award (2016), and MIT Technology Review's 35 Innovators Under 35 (Global) (2016).  He is a Deputy Editor of Science Advances, an editor of Mechanics of Materials, an associate editor of International Journal of Smart and Nano Materials, and a past associate editor of ASME Journal of Applied Mechanics and Research.\u003C/p>","2025-02-10T23:00:41.455Z","103",{"id":1577,"name":1420,"alternativeText":16,"caption":16,"width":1578,"height":1579,"formats":1580,"hash":1586,"ext":819,"mime":822,"size":1587,"url":1588,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1589,"updatedAt":1589},93,342,448,{"thumbnail":1581},{"ext":819,"url":1582,"hash":1583,"mime":822,"name":1433,"path":16,"size":1584,"width":1585,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Picture1_be1e504a43.jpg","thumbnail_Picture1_be1e504a43",4.02,119,"Picture1_be1e504a43",20.03,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Picture1_be1e504a43.jpg","2025-02-10T23:00:28.430Z",[],"-84","-91",{"id":56,"groupTitle":1594,"sessions":1595},"Track 8: Reliability, Simulation and modelling",[1596],{"id":96,"session":1597},{"id":96,"title":1598,"teaser":1599,"body":1600,"createdAt":1601,"updatedAt":1602,"publishedAt":1603,"url_path_id":1604,"contacts":1605,"url_path":1641},"Mechanics and Devices for Mechanical Haptics","\u003Cp style=\"text-align:justify;\">Unlike visual or auditory stimuli, touch commands immediate attention and elicits instinctive reactions, making it essential for environmental interactions, personal safety, and emotional connections. Recent advancements in bioelectronics have transformed traditional haptic devices into wearable systems, unlocking new possibilities for tactile interactions. However, existing wearable haptics are often constrained by unimodal feedback, continuous energy demands, and attachment challenges.\u003C/p>","\u003Cp style=\"text-align:justify;\">This talk will cover recent progress in mechanical haptics developed in my group, focusing on both wearable and structured approaches to enhancing tactile interactions. We will introduce curved origami-based stiffness manipulation, enabling in situ stiffness switching across positive, zero, and negative ranges, with applications in robotics and a novel first-person haptic device that synchronizes with virtual environments for realistic material perception. Additionally, we will present a wireless, real-time haptic interface that leverages a mechanically bistable mechanism inspired by the Kresling origami pattern, enabling diverse tactile sensations—including normal pressure, shear force, and vibrations—by storing and releasing mechanical energy through the skin. Finally, we will discuss a bistable soft-pneumatic textile interface for full-body haptics, offering energy-efficient, multimodal touch feedback for immersive and assistive applications. These advancements represent a paradigm shift in haptic technology, broadening its applications in human-machine interactions, rehabilitation, and immersive digital experiences.\u003C/p>","2025-02-10T23:09:32.296Z","2025-02-10T23:09:34.045Z","2025-02-10T23:09:34.039Z","111",[1606],{"id":1607,"name":1608,"committee":16,"position":16,"affiliation":1609,"email":16,"biography":1610,"createdAt":1611,"updatedAt":1611,"url_path_id":1612,"contactPhoto":1613,"socialLinks":1639,"url_path":1640},79,"Hanqing Jiang","Westlake University, China","\u003Cp style=\"text-align:justify;\">Hanqing Jiang is a Chair Professor of Mechanical Engineering at Westlake University, China. Before joining Westlake in June 2021, he was a faculty member in Mechanical Engineering at Arizona State University from 2006 to 2021. He earned his Ph.D. in Solid Mechanics from Tsinghua University in 2001. His research focuses on origami- and kirigami-based mechanical metamaterials for robotics and human-machine interactions, lithium-metal batteries, and unconventional electronics. He has authored five book chapters and over 150 peer-reviewed journal papers. He was elected an ASME Fellow in 2016, a member of the European Academy of Sciences and Arts in 2024, and a member of the European Academy of Sciences in 2024. He currently serves as Chair of the Executive Committee of the ASME Materials Division and was President of the Society of Engineering Science in 2022. His selected honors include an NSF CAREER Award (2009), the ASME Worcester Reed Warner Medal (2021), and the Yonggang Huang Engineering Science Medal (2025).\u003C/p>","2025-02-10T23:01:47.699Z","104",{"id":1614,"name":1420,"alternativeText":16,"caption":16,"width":1615,"height":1615,"formats":1616,"hash":1635,"ext":819,"mime":822,"size":1636,"url":1637,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1638,"updatedAt":1638},94,1320,{"large":1617,"small":1622,"medium":1626,"thumbnail":1631},{"ext":819,"url":1618,"hash":1619,"mime":822,"name":1620,"path":16,"size":1621,"width":825,"height":825},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Picture1_071d814c46.jpg","large_Picture1_071d814c46","large_Picture1.jpg",99.88,{"ext":819,"url":1623,"hash":1624,"mime":822,"name":1427,"path":16,"size":1625,"width":66,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Picture1_071d814c46.jpg","small_Picture1_071d814c46",24.12,{"ext":819,"url":1627,"hash":1628,"mime":822,"name":1629,"path":16,"size":1630,"width":838,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Picture1_071d814c46.jpg","medium_Picture1_071d814c46","medium_Picture1.jpg",52.65,{"ext":819,"url":1632,"hash":1633,"mime":822,"name":1433,"path":16,"size":1634,"width":1212,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Picture1_071d814c46.jpg","thumbnail_Picture1_071d814c46",4.05,"Picture1_071d814c46",203.11,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Picture1_071d814c46.jpg","2025-02-10T23:01:31.180Z",[],"-85","-92",{"id":202,"groupTitle":1643,"sessions":1644},"Track 9: Wireless devices and systems",[1645],{"id":164,"session":1646},{"id":164,"title":1647,"teaser":1648,"body":1649,"createdAt":1650,"updatedAt":1651,"publishedAt":1652,"url_path_id":1653,"contacts":1654,"url_path":1691},"Designing long-term stable, wireless, stretchable and hair-compatible EEG system","\u003Cp style=\"text-align:justify;\">Electroencephalography (EEG) system played an important role in both neuroscience research, diagnostics and brain-computer interface enable therapeutic applications. However, conventional EEG monitoring system faces several hardware limitations, including fast drying of EEG gels, complex wiring and preparation procedures, and difficulty to comply with the diverse head anthropometry and hair conditions.\u003C/p>","\u003Cp style=\"text-align:justify;\">In this talk, we will discuss about our strategies to overcome these challenges in our wearable EEG system, including hydrogel-based EEG electrodes to achieve low-impedance and long-term stability, integration of wireless circuits with hydrogel electrode to achieve wireless EEG recording, kirigami-inspired mesh design with liquid metal interconnects to achieve stretchability, and conical 3D-printed electrode with embedded hydrogel to achieve hair capability. We validate our system through five-week offline and online EEG-based brain-computer interface tasks, demonstrating its exceptional performance in continuous monitoring and dynamic applications. These results mark a promising advance toward wearable, non-invasive neural interfaces in clinical diagnostics and everyday use.\u003C/p>","2025-03-20T12:34:02.778Z","2025-03-20T12:34:04.543Z","2025-03-20T12:34:04.534Z","122",[1655],{"id":1327,"name":1656,"committee":16,"position":16,"affiliation":1657,"email":16,"biography":1658,"createdAt":1659,"updatedAt":1659,"url_path_id":1660,"contactPhoto":1661,"socialLinks":1689,"url_path":1690},"Huiliang Wang","University of Texas at Austin, USA","\u003Cp style=\"text-align:justify;\">Dr. Huiliang Wang is an Assistant Professor in the biomedical engineering department at University of Texas at Austin, where he leads his research team in the design of functional materials and electronic device in neural interface engineering. In particular, his lab focuses on the development of new technologies to record and modulate neural activity using minimally invasive methods. He did his PhD in Materials Science and Engineering with Prof Zhenan Bao at Stanford University and his postdoctoral research with Prof Karl Deisseroth at Stanford Bioengineering department. He has won several awards including NSF CAREER Award, NIH R35 Maximizing Investigators’ Research Award (MIRA), Med-X Young Investigator Award, American Society for Engineering Education (ASEE) Biomedical Engineering Teaching Award and MIT Technology Review 35 Innovators under 35 (China). \u003C/p>","2025-03-20T12:33:21.348Z","121",{"id":1662,"name":1663,"alternativeText":16,"caption":16,"width":1664,"height":1664,"formats":1665,"hash":1685,"ext":819,"mime":822,"size":1686,"url":1687,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1688,"updatedAt":1688},120,"Profile picture_Huiliang Wang.jpg",4480,{"large":1666,"small":1671,"medium":1676,"thumbnail":1681},{"ext":819,"url":1667,"hash":1668,"mime":822,"name":1669,"path":16,"size":1670,"width":825,"height":825},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Profile_picture_Huiliang_Wang_d2949eddd3.jpg","large_Profile_picture_Huiliang_Wang_d2949eddd3","large_Profile picture_Huiliang Wang.jpg",65.4,{"ext":819,"url":1672,"hash":1673,"mime":822,"name":1674,"path":16,"size":1675,"width":66,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Profile_picture_Huiliang_Wang_d2949eddd3.jpg","small_Profile_picture_Huiliang_Wang_d2949eddd3","small_Profile picture_Huiliang Wang.jpg",20.89,{"ext":819,"url":1677,"hash":1678,"mime":822,"name":1679,"path":16,"size":1680,"width":838,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Profile_picture_Huiliang_Wang_d2949eddd3.jpg","medium_Profile_picture_Huiliang_Wang_d2949eddd3","medium_Profile picture_Huiliang Wang.jpg",39.66,{"ext":819,"url":1682,"hash":1683,"mime":822,"name":1684,"path":16,"size":1474,"width":1212,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Profile_picture_Huiliang_Wang_d2949eddd3.jpg","thumbnail_Profile_picture_Huiliang_Wang_d2949eddd3","thumbnail_Profile picture_Huiliang Wang.jpg","Profile_picture_Huiliang_Wang_d2949eddd3",1875.48,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Profile_picture_Huiliang_Wang_d2949eddd3.jpg","2025-03-20T12:33:04.792Z",[],"-100","-101",{"id":151,"groupTitle":1693,"sessions":1694},"Track 10: Emerging Applications",[1695],{"id":196,"session":1696},{"id":196,"title":1697,"teaser":1698,"body":1699,"createdAt":1700,"updatedAt":1701,"publishedAt":1702,"url_path_id":1703,"contacts":1704,"url_path":1746},"Ambient Printing of Pristine Oxide Films Enabled by Liquid Metals","\u003Cp style=\"text-align:justify;\">This talk will discuss efforts to take advantage of liquid metals to directly print both metallic and oxide thin films at ambient conditions.  The metal is a gallium-based metal alloy that is a low-viscosity liquid at room temperature with low toxicity and negligible vapor pressure.  Despite the large surface tension of the metal, it can be printed into non-spherical shapes due to the presence of an ultra-thin surface oxide skin.  \u003C/p>","\u003Cp style=\"text-align:justify;\">The ability to directly print liquid metal alloys into 3D structures enables soft, self-healing, and ultra-stretchable conductors. We recently discovered a way to separate the oxide from the liquid using fluid instabilities. The process works by dragging a meniscus of liquid metal across a surface. At the right conditions, the fluid inside the meniscus is unstable and only oxide is left behind on the surface. Doing so enables direct-write printing of very thin (~4 nm) oxides without the need for vacuum processing.  Surprisingly, the oxide is conductive because the printing process deposits a bilayer film with a metallic interior.  The ability to deposit oxide coatings is important for electronics, sensors, optics, and touch screens.  This approach is appealing because it avoids vacuum processing that is typically used to deposit oxides.\u003C/p>","2025-03-14T15:38:51.573Z","2025-03-14T15:38:53.381Z","2025-03-14T15:38:53.376Z","120",[1705],{"id":1706,"name":1707,"committee":16,"position":16,"affiliation":1708,"email":16,"biography":1709,"createdAt":1710,"updatedAt":1710,"url_path_id":1711,"contactPhoto":1712,"socialLinks":1744,"url_path":1745},83,"Michael Dickey","North Carolina State University, USA","\u003Cp style=\"text-align:justify;\">Michael Dickey received a BS in Chemical Engineering from Georgia Institute of Technology (1999) and a PhD from the University of Texas (2006) under the guidance of Professor Grant Willson. From 2006-2008 he was a post-doctoral fellow in the lab of Professor George Whitesides at Harvard University.  He is currently the Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering at NC State University.  He completed a sabbatical at Microsoft in 2016 and EPFL in 2023.  Michael’s research interests include soft matter (liquid metals, gels, polymers) for soft and stretchable devices (electronics, energy harvesters, textiles, and soft robotics).\u003C/p>","2025-03-14T15:38:03.646Z","119",{"id":1585,"name":1713,"alternativeText":16,"caption":16,"width":1714,"height":1715,"formats":1716,"hash":1740,"ext":819,"mime":822,"size":1741,"url":1742,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1743,"updatedAt":1743},"michael dickey black and white (1).jpg",4016,6016,{"large":1717,"small":1723,"medium":1729,"thumbnail":1734},{"ext":819,"url":1718,"hash":1719,"mime":822,"name":1720,"path":16,"size":1721,"width":1722,"height":825},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_michael_dickey_black_and_white_1_4a8641d2fc.jpg","large_michael_dickey_black_and_white_1_4a8641d2fc","large_michael dickey black and white (1).jpg",80.08,668,{"ext":819,"url":1724,"hash":1725,"mime":822,"name":1726,"path":16,"size":1727,"width":1728,"height":66},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_michael_dickey_black_and_white_1_4a8641d2fc.jpg","small_michael_dickey_black_and_white_1_4a8641d2fc","small_michael dickey black and white (1).jpg",19.55,334,{"ext":819,"url":1730,"hash":1731,"mime":822,"name":1732,"path":16,"size":1733,"width":1197,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_michael_dickey_black_and_white_1_4a8641d2fc.jpg","medium_michael_dickey_black_and_white_1_4a8641d2fc","medium_michael dickey black and white (1).jpg",46.36,{"ext":819,"url":1735,"hash":1736,"mime":822,"name":1737,"path":16,"size":1738,"width":1739,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_michael_dickey_black_and_white_1_4a8641d2fc.jpg","thumbnail_michael_dickey_black_and_white_1_4a8641d2fc","thumbnail_michael dickey black and white (1).jpg",3.1,104,"michael_dickey_black_and_white_1_4a8641d2fc",1733.23,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/michael_dickey_black_and_white_1_4a8641d2fc.jpg","2025-03-14T15:37:46.231Z",[],"-98","-99",{"data":1748,"meta":1749},{"id":376,"heading":371,"createdAt":377,"updatedAt":378,"publishedAt":379,"url_path_id":380,"url_path":372,"contentType":123},{},1778852370386]