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DataPort","2025-05-19T15:50:25.567Z","2025-05-19T15:51:19.719Z","2025-05-19T15:50:27.934Z","203",{"id":284,"name":1263,"alternativeText":16,"caption":16,"width":1264,"height":987,"formats":1265,"hash":1287,"ext":19,"mime":20,"size":1179,"url":1288,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1289,"updatedAt":1289},"LargeDataPortLogo.png",1002,{"large":1266,"small":1271,"medium":1277,"thumbnail":1282},{"ext":19,"url":1267,"hash":1268,"mime":20,"name":1269,"path":16,"size":1270,"width":825,"height":987},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/large_Large_Data_Port_Logo_e13a318ba1.png","large_Large_Data_Port_Logo_e13a318ba1","large_LargeDataPortLogo.png",33.51,{"ext":19,"url":1272,"hash":1273,"mime":20,"name":1274,"path":16,"size":1275,"width":66,"height":1276},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Large_Data_Port_Logo_e13a318ba1.png","small_Large_Data_Port_Logo_e13a318ba1","small_LargeDataPortLogo.png",16.91,72,{"ext":19,"url":1278,"hash":1279,"mime":20,"name":1280,"path":16,"size":1281,"width":838,"height":1238},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Large_Data_Port_Logo_e13a318ba1.png","medium_Large_Data_Port_Logo_e13a318ba1","medium_LargeDataPortLogo.png",26.84,{"ext":19,"url":1283,"hash":1284,"mime":20,"name":1285,"path":16,"size":1286,"width":73,"height":691},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Large_Data_Port_Logo_e13a318ba1.png","thumbnail_Large_Data_Port_Logo_e13a318ba1","thumbnail_LargeDataPortLogo.png",8.03,"Large_Data_Port_Logo_e13a318ba1","https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Large_Data_Port_Logo_e13a318ba1.png","2025-05-19T15:49:59.536Z",{"id":436,"variation":39,"button":1291},[1292],{"id":568,"label":82,"size":43,"color":44,"style":16,"icon":45,"iconPosition":46,"url":1293,"newWindow":8,"downloadable":16,"shape":16},"https://ieee-dataport.org/","-167",{"pagination":1296},{"page":5,"pageSize":177,"pageCount":5,"total":96},{"id":56,"heading":354,"pageHeader":1298,"sections":1300},{"id":56,"description":1299,"showPageHeader":8,"backgroundColor":98,"image":16},"Explore the Plenary Speakers of IEEE FLEPS 2025, featuring world-renowned experts in flexible and printable electronics and sensor systems.",[1301],{"id":5,"__component":1302,"componentVariation":1303,"contactsVariation":1304,"styles":16,"header":16,"sessionsGroup":1305},"content.sessions","Sessions Base","Card Contact Full",[1306],{"id":5,"groupTitle":16,"sessions":1307},[1308,1349,1397],{"id":90,"session":1309},{"id":90,"title":1310,"teaser":1311,"body":1312,"createdAt":1313,"updatedAt":1314,"publishedAt":1315,"url_path_id":1316,"contacts":1317,"url_path":1348},"Memristive Devices for Neuromorphic Computing","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>June 23, 2025 | 10:35 – 11:35am\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">Neuromorphic computing, inspired by biological intelligence, promises a transformative shift in computational efficiency and adaptability. Memristive devices, which leverage coupled ionic-electronic interactions, physically mimic synapses and neurons, enabling true emulation rather than mere simulation of biological processes.\u003C/p>","\u003Cp style=\"text-align:justify;\">This talk will explore the latest advancements in memristive devices and their role in neuromorphic computing. I will first discuss their application as high-efficiency machine learning accelerators, offering significant energy and throughput advantages. Then, I will examine how these devices enable bio-plausible artificial intelligence systems, moving toward computing architectures that more closely resemble natural intelligence.\u003C/p>","2024-12-17T18:44:15.739Z","2025-05-27T22:59:18.683Z","2024-12-17T18:44:16.924Z","45",[1318],{"id":548,"name":1319,"committee":16,"position":16,"affiliation":1320,"email":16,"biography":1321,"createdAt":1322,"updatedAt":1323,"url_path_id":1324,"contactPhoto":1325,"socialLinks":1346,"url_path":1347},"Joshua Yang","University of Southern California, USA","\u003Cp style=\"text-align:justify;\">J. Joshua Yang is a professor of the Department of Electrical and Computer Engineering at the University of Southern California. His current research interest is Post-CMOS hardware for neuromorphic computing, machine learning and artificial intelligence, where he published several pioneering papers and holds 120 granted US Patents. He is the Founding Chair of the IEEE Neuromorphic Computing Technical Committee, a recipient of the Powell Faculty Research Award and a recipient of UMass distinguished faculty lecturer and UMass Chancellor's Medal, the highest honor of UMass. He is the director of USC-Airforce Center of Excellent on Neuromorphic Computing. He serves on the Advisory Boards of a number of prime international journals and conferences, including serving as an associate editor of Science Advances. Dr. Yang is a Clarivate™ Highly Cited Researcher in the field of Cross-Field and the Top Best Scientists in the Research.com list in the Electronics and Electrical Engineering category.  He was elected to the IEEE Fellow and the National Academy of Inventors (NAI) Fellow for his contributions to resistive switching materials and devices for nonvolatile memory and neuromorphic computing.\u003C/p>","2024-12-17T18:43:33.339Z","2025-02-03T20:33:52.268Z","44",{"id":1326,"name":1327,"alternativeText":16,"caption":16,"width":1328,"height":1328,"formats":1329,"hash":1342,"ext":1331,"mime":1334,"size":1343,"url":1344,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1345,"updatedAt":1345},76,"fff.png.webp",523,{"small":1330,"thumbnail":1337},{"ext":1331,"url":1332,"hash":1333,"mime":1334,"name":1335,"path":16,"size":1336,"width":66,"height":66},".webp","https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_fff_png_bebeea2054.webp","small_fff_png_bebeea2054","image/webp","small_fff.png.webp",14.97,{"ext":1331,"url":1338,"hash":1339,"mime":1334,"name":1340,"path":16,"size":1341,"width":1212,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_fff_png_bebeea2054.webp","thumbnail_fff_png_bebeea2054","thumbnail_fff.png.webp",2.18,"fff_png_bebeea2054",23.49,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/fff_png_bebeea2054.webp","2025-01-08T21:03:59.527Z",[],"-30","-31",{"id":177,"session":1350},{"id":177,"title":1351,"teaser":1352,"body":1353,"createdAt":1354,"updatedAt":1355,"publishedAt":1356,"url_path_id":1357,"contacts":1358,"url_path":1396},"Nanoscale Silver for Flexible and Transparent Electronics: from Development to Commercialization","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>June 24, 2025 | 10:35-11:35am\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">In this presentation, we introduce DuPont’s Activegrid™—a highly flexible, stretchable, and formable silver nanowire-based transparent conductor (TC) that matches or surpasses the optoelectronic performance of conventional brittle sputtered TCs, such as indium tin oxide (ITO).Activegrid inks can be deposited from solution using a variety of high-speed, low-takt-time manufacturing methods, and they require significantly lower processing temperatures—down to just 25°C—compared to other transparent conductors.The technology has already been commercialized in several of the world’s first mass-produced flexible consumer electronic devices, where it primarily serves as the TC in capacitive touch sensors. \u003Cbr> \u003C/p>","\u003Cp style=\"text-align:justify;\">Beyond consumer electronics, Activegrid has been prototyped, qualified, and integrated into a wide range of emerging applications, including smart windows, EMI shielding, photovoltaics, next-generation displays, and biomedical devices. A new generation of Activegrid is now being commercialized specifically for automotive applications, with a focus on transparent heating for LiDAR and camera sensors—delivering substantial performance, design, and processing advantages over incumbent technologies. We will also highlight recent developments in highly concentrated silver nanowire inks and dispersions, which exhibit exceptional electrical and rheological properties. These advanced materials open new opportunities for the design and manufacturing of next-generation flexible and printed electronics.\u003C/p>","2025-04-07T18:58:50.615Z","2025-05-27T23:00:14.942Z","2025-04-07T18:58:52.112Z","156",[1359],{"id":1360,"name":1361,"committee":16,"position":16,"affiliation":1362,"email":16,"biography":1363,"createdAt":1364,"updatedAt":1364,"url_path_id":1365,"contactPhoto":1366,"socialLinks":1394,"url_path":1395},93,"Ajay Virkar","DuPont, USA","\u003Cp style=\"text-align:justify;\">Ajay Virkar is Vice President Advanced Circuits and Packaging at DuPont, focusing on business and technology development initiatives. Prior to this role, he was the Co-founder, CTO, and a Board Member of C3Nano—an advanced materials company acquired by DuPont in August 2024.  At C3Nano, Ajay played a pivotal role in securing multiple rounds of strategic and venture funding, commercializing new technologies used in some of the world’s first flexible consumer electronic devices. He led the development of intellectual property, technology innovation, and managed key partnerships across the global consumer electronics supply chain. Ajay is a co-inventor on over 100 issued patents and has co-authored 13 peer-reviewed journal articles. In addition to supporting multiple hardware and materials startups, he advised the U.S. Department of Energy (DOE)’s Perovskite Solar Initiative.  Beyond to his technical work, Ajay served as an associate producer for Infinite Potential, a documentary about physicist David Bohm. He earned his BS from the University of Illinois and his PhD from Stanford University where his thesis was awarded the Spinger Prize.\u003C/p>","2025-04-07T18:57:50.123Z","155",{"id":721,"name":1367,"alternativeText":16,"caption":16,"width":1368,"height":1369,"formats":1370,"hash":1390,"ext":1372,"mime":822,"size":1391,"url":1392,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1393,"updatedAt":1393},"Ajay Headshot copy.jpeg",669,947,{"small":1371,"medium":1378,"thumbnail":1384},{"ext":1372,"url":1373,"hash":1374,"mime":822,"name":1375,"path":16,"size":1376,"width":1377,"height":66},".jpeg","https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/small_Ajay_Headshot_copy_671ee5fa3e.jpeg","small_Ajay_Headshot_copy_671ee5fa3e","small_Ajay Headshot copy.jpeg",20.74,353,{"ext":1372,"url":1379,"hash":1380,"mime":822,"name":1381,"path":16,"size":1382,"width":1383,"height":838},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/medium_Ajay_Headshot_copy_671ee5fa3e.jpeg","medium_Ajay_Headshot_copy_671ee5fa3e","medium_Ajay Headshot copy.jpeg",39.34,530,{"ext":1372,"url":1385,"hash":1386,"mime":822,"name":1387,"path":16,"size":1388,"width":1389,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Ajay_Headshot_copy_671ee5fa3e.jpeg","thumbnail_Ajay_Headshot_copy_671ee5fa3e","thumbnail_Ajay Headshot copy.jpeg",3.7,110,"Ajay_Headshot_copy_671ee5fa3e",56.44,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Ajay_Headshot_copy_671ee5fa3e.jpeg","2025-04-07T18:57:46.649Z",[],"-126","-127",{"id":5,"session":1398},{"id":5,"title":1399,"teaser":50,"body":1400,"createdAt":1401,"updatedAt":1402,"publishedAt":1403,"url_path_id":1404,"contacts":1405,"url_path":1428},"Decoding the Essence of Materials Chemistry in Bio-interfaced Electronics","\u003Ch4 class=\"h4\" style=\"text-align:justify;\">\u003Cstrong>June 25, 2025 | 10:35 – 11:35am\u003C/strong>\u003C/h4>\u003Cp style=\"text-align:justify;\">In the digital and big data era, electronic devices are crucial for addressing societal challenges and enhancing life quality. However, the rigid nature of traditional electronics limits their applicability. Flexible electronic devices emerge as a solution, offering seamless integration with various environments and human experiences. Despite considerable progress in research, the market adoption of flexible sensors remains limited. This talk delves deep into the fundamental materials chemistry questions within flexible electronics, aiming for a clearer and deeper understanding of its core principles. Additionally, I will explore the principles of conformal sense digitalization, its applications, and the challenges ahead in unlocking its full potential.\u003C/p>","2024-11-25T15:52:41.093Z","2025-05-27T22:58:13.858Z","2024-11-25T15:52:43.679Z","26",[1406],{"id":96,"name":1407,"committee":16,"position":16,"affiliation":1408,"email":16,"biography":1409,"createdAt":1410,"updatedAt":1410,"url_path_id":1411,"contactPhoto":1412,"socialLinks":1426,"url_path":1427},"Xiaodong Chen","Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore","\u003Cp style=\"text-align:justify;\">Professor Xiaodong Chen holds the President's Chair Professorship in Materials Science and Engineering at Nanyang Technological University (NTU), Singapore, with courtesy appointments in both Chemistry and Medicine. His research interests span mechanomaterials science and engineering, flexible electronics technology, sense digitalization, cyber-human interfaces and systems, and carbon-negative technology. Prof. Chen's outstanding scientific contributions have been recognized with numerous awards, including the Singapore President's Science Award, Singapore National Research Foundation (NRF) Investigatorship and NRF Fellowship, the Friedrich Wilhelm Bessel Research Award, Dan Maydan Prize in Nanoscience and Nanotechnology, Winner of Falling Walls, and Kabiller Young Investigator. He is an elected member of the Singapore National Academy of Science, the Academy of Engineering Singapore, and the German National Academy of Sciences Leopoldina, and an elected fellow of the Royal Society of Chemistry, the Chinese Chemical Society, and American Institute for Medical and Biological Engineering (AIMBE). Prof. Chen also serves on the editorial advisory boards of numerous esteemed international journals, including Advanced Materials, Small, and Nanoscale Horizons. Currently, he is the Editor-in-Chief of ACS Nano, a flagship journal in nanoscience and nanotechnology. \u003C/p>","2024-11-25T15:51:38.895Z","25",{"id":177,"name":1413,"alternativeText":16,"caption":16,"width":1414,"height":1415,"formats":1416,"hash":1422,"ext":819,"mime":822,"size":1423,"url":1424,"previewUrl":16,"provider":23,"provider_metadata":16,"createdAt":1425,"updatedAt":1425},"Chen_Fleps.jpg",391,459,{"thumbnail":1417},{"ext":819,"url":1418,"hash":1419,"mime":822,"name":1420,"path":16,"size":1421,"width":479,"height":1212},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/thumbnail_Chen_Fleps_64c95d930f.jpg","thumbnail_Chen_Fleps_64c95d930f","thumbnail_Chen_Fleps.jpg",3.29,"Chen_Fleps_64c95d930f",17.72,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/fleps25/Chen_Fleps_64c95d930f.jpg","2024-11-25T15:50:54.349Z",[],"-13","-14",{"data":1430,"meta":1431},{"id":56,"heading":354,"createdAt":359,"updatedAt":360,"publishedAt":361,"url_path_id":362,"url_path":355,"contentType":123},{},1778852370386]