IEEE FLEPS 2025 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
IEEE FLEPS 2025 will bring sensor and sensor systems practitioners from all over the world together to interact and network with colleagues, learn of the latest printed electronics technology innovations, and meet the vendors of Flexible and Printable Sensors and Systems that supply products and solutions to technical needs. The exhibition will be closely integrated with the technical program through tutorials, plenary sessions, industrial panels, sensor and sensor systems demonstrations, industrial innovation sessions, and social activities for delegates and exhibitors alike.
Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore
University of Southern California, USA
