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    Ravinder Dahiya

    Northeastern University, Boston, USA

  • thumbnail_Joseph_Wang_d981b5294c.jpg
    Joseph Wang

    University of California, San Diego (UCSD)

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    Northwestern University, USA

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    University of Tokyo, Japan

  • thumbnail_Luisa_Torsi_a336994cfd.png
    Luisa Torsi

    University of Bari, Italy

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    Zhenan Bao

    Stanford University, USA

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    Luigi G. Occhipinti

    Cambridge University, UK

  • thumbnail_nathan_Arokia_c7e97b489a.jpg
    Arokia Nathan

    Darwin College, Univ. of Cambridge, UK

  • thumbnail_Aaron_Thean_23197ed2d4.jpg
    Aaron Voon-Yew Thean

    National University Singapore

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    University of Sydney, Australia

  • thumbnail_Zeynep_Celik_790880aabf.jpg
    Zeynep Celik

    University of Texas, USA

  • thumbnail_George_Malliaras_f8b100a370.jpg
    George Malliaras

    University of Cambridge, UK

  • thumbnail_Paolo_Lugli_f988bd1784.jpg
    Paolo Lugli

    University of Bozen, Italy

  • thumbnail_Joachim_Burghartz_1a96ed2f8b.jpg
    Joachim Burghartz

    IMS CHIPS, Germany

  • thumbnail_vincenzo_vinciguerra_51b0815e76.jpg
    Vincenzo Vinciguerra

    STMicroelectronics, Italy

  • thumbnail_vassili_karanassios_fad6bbbbf2.jpg
    Vassili Karanassios

    Waterloo University, Canada

  • thumbnail_Praveen_Ramamurthy_858e7ab836.png
    Praveen C Ramamurthy

    Indian Institute of Science, Bangalore, India

  • thumbnail_Simon_Johnson_d605ddc0ac.jpg
    Simon Johnson

    Centre for Process Innovation, UK