The IEEE FLEPS 2025 Program is now available! Download it here to plan your attendance at FLEPS 2025!

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    Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore

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    University of Southern California, USA

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    DuPont, USA

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    Northwestern University, USA

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    University of Sydney, Australia

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    Westlake University, China

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    IEEE Standards Association

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    BSI Group

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    Ravinder Dahiya

    Northeastern University, Boston, USA

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    DuPont, USA

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    Yonsei University, Korea

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    USC, USA

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    Yifei Luo

    A*STAR, Singapore

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