General Co-Chairs
Benjamin TeeNational University of Singapore, Singapore
Nanshu LuUniversity of Texas, Austin, USA
Meet the organizers of IEEE FLEPS 2025, dedicated professionals coordinating an impactful event on flexible and printable electronics research and innovation.

National University of Singapore, Singapore

University of Texas, Austin, USA

CALTECH, USA

National University of Singapore, Singapore

Northeastern University, Boston, USA

Cambridge University, UK

University of Sydney, Australia

National University of Singapore

Pragmatic Semiconductor, UK

VTT, FI

Baylor University

Harvard University, USA

National University of Singapore, Singapore

Gachon University, Korea

A*STAR, Singapore

University of Southampton, UK

Aarhus University, Denmark

STMicroelectronics, Italy

Western Sydney University, Australia

National University of Singapore, Singapore

Indian Institute of Technology Jodhpur, India

HKUST

UCSD, USA

Politecnico di Milano, Italy

York University, Canada

Indian Institute of Science Education and Research, Bhopal, India

University of Groningen, The Netherlands

Northeastern University, Boston, USA

TU Wien and Danube University Krems, Austria

Cambridge University, UK

University of Wisconsin - Madison, USA

Tampere University, Finland

University of Genova, Italy