General Co-Chairs
- Benjamin Tee
National University of Singapore, Singapore
- Nanshu Lu
University of Texas, Austin, USA
Meet the organizers of IEEE FLEPS 2025, dedicated professionals coordinating an impactful event on flexible and printable electronics research and innovation.
National University of Singapore, Singapore
University of Texas, Austin, USA
CALTECH, USA
National University of Singapore, Singapore
Northeastern University, Boston, USA
Cambridge University, UK
University of Sydney, Australia
National University of Singapore
Pragmatic Semiconductor, UK
VTT, FI
Baylor University
Harvard University, USA
National University of Singapore, Singapore
Gachon University, Korea
A*STAR, Singapore
University of Southampton, UK
Aarhus University, Denmark
STMicroelectronics, Italy
Western Sydney University, Australia
National University of Singapore, Singapore
Indian Institute of Technology Jodhpur, India
HKUST
UCSD, USA
Politecnico di Milano, Italy
York University, Canada
Indian Institute of Science Education and Research, Bhopal, India
University of Groningen, The Netherlands
Northeastern University, Boston, USA
TU Wien and Danube University Krems, Austria
Cambridge University, UK
University of Wisconsin - Madison, USA
Tampere University, Finland
University of Genova, Italy