IEEE FLEPS 2025 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the areaof Flexible and Printable Sensors and Systems.
Call for Papers
Submit your research to IEEE FLEPS 2025. Explore the Call for Papers for topics, submission guidelines, and key dates in flexible and printable electronics.
Topics of Interest
- Organic/Inorganic Electronics and Sensors
- Materials and Design for Flexible, Stretchable, and Printed Systems
- Advanced Manufacturing Techniques
- High-throughput Printable Electronics
- Hybrid Systems and Heterogeneous Integration
- Stretchable/Shrinkable Sensors and Electronics
- Wearable and Implantable Systems
- Degradable/Reusable Sensors and Systems
- Printed Large-Area Sensors and Systems
- Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
- Emerging applications of Flexible Electronics in AI, Robotics, Cognitive Systems, IoT, smart cities etc.
- Reliability, Simulation and Modelling
- Electronics for Sustainability
- Standards for Flexible and Stretchable Electronics
Important Dates
- February 10, 2025
Option B: Submit to IEEE Sensors Letters
- March 2, 2025
Option A: Submit to IEEE FLEPS 2025
Proceedings - April 18, 2025
Notification of Acceptance
- May 2, 2025
Final Manuscript Submission Deadline