IEEE FLEPS 2025 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the areaof Flexible and Printable Sensors and Systems.

  • Organic/Inorganic Electronics and Sensors
  • Materials and Design for Flexible, Stretchable, and Printed Systems
  • Advanced Manufacturing Techniques
  • High-throughput Printable Electronics
  • Hybrid Systems and Heterogeneous Integration
  • Stretchable/Shrinkable Sensors and Electronics
  • Wearable and Implantable Systems
  • Degradable/Reusable Sensors and Systems
  • Printed Large-Area Sensors and Systems
  • Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
  • Emerging applications of Flexible Electronics in AI, Robotics, Cognitive Systems, IoT, smart cities etc.
  • Reliability, Simulation and Modelling
  • Electronics for Sustainability
  • Standards for Flexible and Stretchable Electronics
  • February 10, 2025

    Option B: Submit to IEEE Sensors Letters

  • March 2, 2025

    Option A: Submit to IEEE FLEPS 2025
    Proceedings

  • April 18, 2025

    Notification of Acceptance

  • May 2, 2025

    Final Manuscript Submission Deadline